features low profile space ideal for automated placement glass passivated chip junctions low forward voltage drop low leakage current high forward surge capability high temperature soldering 260 /10 seconds at terminals component in accordance to rohs 2002/95/1 and weee 2002/96/ec mechanical date case: jedec sod-123fl molded plastic body over glass passivated chip terminals: solder plated, solderable per j-std-002b and jesd22-b102d polarity: laser band denotes cathode end weight: 0.017gram maximum ratings & thermal characteristics & electrical characteristics (t a = 25 c unless otherwise noted) symbol 0.5a 0.5b 0.5c 0.5d 0.5f 0.5g unit v rrm 50 100 150 200 300 400 v v rms 35 70 105 140 210 280 v v dc 50 100 150 200 300 400 v i f(av) a i fsm a v f v i r a t rr ns r ja /w t j , t stg note1: mounted on fr-4 p.c.b. with 0.9x1.5 mm copper pad areas ( 35 m thick) dsf- maximum repetitive peak reverse voltage maximum rms voltage maximum dc blocking voltage 5.0 100 maximum average forward rectified current 0.5 peak forward surge current 8.3 ms single half sine- wave superimposed on rated load 15 operating junction and storage temperature range ?55 to +150 0.95 1.25 35 maximum reverse recovery time at i f = 0.5 a , i r = 1.0 a , i rr = 0.25 a typical thermal resistance maximum instantaneous forward voltage at 0.5a maximum dc reverse current t a = 25 at rated dc blocking voltage t a = 100 150 dsf0.5a-dsf0.5k surface mount superfast rectifiers http://www.luguang.cn mail:lge@luguang.cn 1. 0 0. 2 2. 8 0. 1 1. 9 0. 1 c at h ode b a nd t op v i ew 3. 7 0. 2 0. 6 0. 25 1. 4 0 . 15 0. 10- 0. 30 sod-123fl dimensions in millimeters
characteristic curves (t a =25 unless otherwise noted) dsf0.5a-dsf0.5k surface mount superfast rectifiers http://www.luguang.cn mail:lge@luguang.cn
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